Annual Review 2024-2025

A N N U A L R E V I E W 2 0 2 4 / 2 5 52 I N S T R UM E N T D E V E L O P M E N T A N D T E C H N I C A L S UMM A RY Microscope Main Capabilities Accelerating Voltages Titan Krios I Cryo-EM, Cryo-ET 80, 120, 200, 300 kV Titan Krios II Cryo-EM, Cryo-ET 80, 120, 200, 300 kV Titan Krios III Cryo-EM, Cryo-ET 80, 120, 200, 300 kV Titan Krios IV Cryo-EM, Cryo-ET 80, 120, 200, 300 kV Titan Krios V Cryo-EM, Cryo-ET 80, 120, 200, 300 kV Glacios Cryo-EM, Cryo-ET 200 kV Aquilos Cryo-SEM, Cryo-FIB 3 to 30 kV JEOL ARM200F Atomic scale STEM imaging, EELS, EDX, electron diffraction 80, 200 kV JEOL ARM300F Atomic scale TEM and STEM imaging, electron diffraction, 4D-STEM, EDX 3 0, 60, 80, 160, 200, 300 kV Electron Microscopes Beamline Main Capabilities Energy / Wavelength Range Versatile MX micro (VMXm) Micro- and nano-focus in vacuum cryo-macromolecular crystallography 7 - 28 keV Versatile MX in situ (VMXi) In situ microfocus, room temperature macromolecular crystallography, Serial Synchrotron Crystallography 10 - 25 keV I03 - UDC MX High Throughput (HT) Unattended Data Collection (UDC) Macromolecular Ccrystallography (MX), Multiwavelength Anomalous Diffraction (MAD) 5 - 25 keV I04 - Microfocus MX MX, MAD, variable and microfocus MX 6 - 2018 keV I04-1 - Monochromatic MX MX, XChem fragment screening 13.53 keV (fixed wavelength) I05 - ARPES Angle-Resolved PhotoEmission Spectroscopy (ARPES) and nano-ARPES 18 - 240 eV; 500 eV I06 - Nanoscience X-ray Absorption Spectroscopy (XAS), X-ray photoemission microscopy and X-ray magnetic circular and linear dichroism 80 eV – 2200 eV I07 - Surface and Interface Diffraction Surface X-ray diffraction (SXRD), Grazing Incidence X-ray Diffraction (GIXD), Grazing Incidence Small Angle X-ray Scattering (GISAXS), X-ray Reflectivity (XRR) 6 - 30 keV B07 - VerSoX: Versatile Soft X-ray Branch C: Ambient Pressure XPS and NEXAFS 110 - 2800 eV Branch B: NEXAFS and High-Throughput XPS 45 - 2200 eV I08 - Scanning X-ray Microscopy Scanning X-ray microscopy, NEXAFS/ XANES, X-ray fluorescence (XRF) I08 branch: 250 eV - 4.4 keV I08-1 - Soft and Tender X-ray Ptychography branch: 250 - 2000 eV I09 - Atomic and Electronic Structure of Surfaces and Interfaces XPS (including HAXPES), X-ray Standing Waves (XSW), Near Edge X-ray Absorption Fine Structure (NEXAFS), energy-scanned photoelectron diffraction Hard X-rays: 2.1 - 18+20 keV I10 - BLADE: Beamline for Advanced Dichroism Experiments Soft X-ray resonant scattering, XAS and X-ray magnetic circular and linear dichroism Circular: 400-1600 eV; Linear Horizontal: 250- 1600 eV; Linear Vertical: 480-1600 eV I11 - High Resolution Powder Diffraction X-ray powder diffraction 7 – 25 keV (1.7 - 0.5 - 2.1 Å) DIAD: Dual Imaging and Diffraction Correlated X-ray computed tomography (XCT) and microfocus X-ray powder diffraction (XRD) Imaging: 7 - 38 keV Diffraction: 7 - 38keV Beamlines